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Adaptive Cooling of Integrated Circuits Using Digital Microfluidics
Krishnendu Chakrabarty, Philip Y. Paik, and Vamsee K. Pamula
ISBN 978-1-59693-138-1
Copyright 2007
Pages: 206
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  • Description
  • Contents
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Put yourself at the cutting edge of adaptive on-the-fly cooling techniques for integrated circuits with this definitive introduction to the droplet-based technology blazing the way. Straight from the research group pioneering digital microfluidics, the book demonstrates its feasibility as an enabling platform both theoretically and experimentally, and presents architectural and implementation methodologies together with prototypes for delivering discrete droplets in a reconfigurable manner to any hot-spot, with spatial resolutions comparable to the hot-spot footprint itself.

After reviewing cooling principles and current methods, this groundbreaking work delivers a comprehensive framework for droplet-based systems that can selectively and adaptively improve heat transfer from localized hot-spots. It introduces design methodology for a droplet-based architecture, and explains how to characterize heat transfer of droplets experimentally and ways to implement various feedback methods required for closed-loop control of adaptive cooling. You’ll find methods for, and demonstrations of, both simple hot-spot cooling and adaptive hot-spot cooling illustrating the effects of effective flow-rate and hot-spot power density. Moreover, the design and fabrication of several droplet-based cooling prototypes provide an invaluable starting point for your own efforts in tackling thermal issues in chip design. Supported with 70 illustrations and photographs, this definitive work puts state-of-the-art advances at your fingertips that will prove invaluable in tackling high power dissipation and thermal profiles that current methods cannot adequately address.

Related Titles
Fundamentals and Applications of Microfluidics, Second Edition ; Nam-Trung Nguyen and Steven T. Wereley
Microfluidics for Biotechnology ; Jean Berthier and Pascal Silberzan
Thermal Management of Integrated Circuits — Heat Generation in Integrated Circuits. Thermal Management and IC Design. Thermodynamics of Cooling Devices.

Cooling Devices for Integrated Circuits — Cooling Devices for Integrated Circuits. Survey of Current Methods: Fan-based Cooling, Macrofluidic-based Cooling, MEMS-based Cooling, Microfluidic-based Cooling.

Adaptive Hot-Spot Cooling Principles and Design — Concepts of Adaptive Hot-Spot Cooling. Digital Microfluidics as a Cooling Platform. Thermal Feedback Control Mechanisms. IC and Package-Level Integration.

Technology Development — Temperature Measurement. Hot-Spot Simulation Design. Design, Fabrication, and testing of Initial Prototypes. Digital Microfluidics on Printed Circuit Board.

Thermal Effects of Digital Microfluidic Devices — Methods for Characterization of Thermal Effects. Experimental Results for a System with Oil. Experimental Results for a System with Air.

Simple Hot-Spot Cooling — Methods for Simple Hot-Spot Cooling. Demonstration of Simple Hot-Spot Cooling. Effects of Effective Flow-Rate and Hot-Spot Power Density.

Adaptive Hot-Spot Cooling — Methods for Adaptive Hot-Spot Cooling. Demonstration of Adaptive Hot-Spot Cooling. Effects of Effective Flow-Rate and Hot-Spot Power Density.

Philip Y. Paik is a microfluids design engineer at Advanced Liquid Logic, Inc., in North Carolina. He received his Ph.D. in electrical engineering from Duke University.

Vamsee K. Pamula is co-founder and vice president of Advanced Liquid Logic, Inc. in North Carolina. A member of IEEE, he earned his Ph.D. in electrical engineering at Duke University.

Krishnendu Chakrabarty is associate professor in the Department of Electrical and Computer Engineering at Duke University, North Carolina. He is the author or coauthor of six books in the IC field, hehas contributed chapters to 13 additional works, and he has published over 200 technical papers. He received his Ph.D. in computer science and engineering from the University of Michigan.

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