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Microwave Circuit Modeling Using Electromagnetic Field Simulation
Daniel G. Swanson, Jr. and Wolfgang J.R. Hoefer
ISBN 978-1-58053-688-2
Copyright 2003
Pages: 496
 
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  • Description
  • Reviews
  • Contents
  • Author
This unique “how to“ book is an ideal introduction to electromagnetic field-solvers. It provides you with helpful advice on selecting the right tools for your RF and high-speed digital circuit design work. The focus is on the strengths and weaknesses of the major commercial software packages. . Featuring full-color illustrations, this practical resource offers you invaluable tips and techniques on the use and evaluation of these products.

A generous amount of case study material is presented, including a ‘what went wrong in the design process’ discussion, when applicable. Color plots of current density and various field quantities included throughout the book help you better understand the fundamental behavior of the circuits being studied. Stress is given to the impact of meshing, geometrical resolution and convergence on the solution process, showing you that you can better control and greatly influence the quality and speed of the solution. You’ll appreciate solving problems using the fundamental, underlying physics, rather than the more approximate methods used in the past. Specific design information on transitions in multilayer PCBs and PCB connectors is not available in any other book.

Supplementary Material

Click here to see errata replacement figures 3.12 - 3.25.

Important!
E-Books may not be copied or printed.
See e-Bookstore Information Page before ordering.
"This book is unique in the way it broaches the subject of electromagnetic simulators, not from the inside out, beginning perhaps with an extensive theoretical development and culminating in an algorithmic implementation. Rather, the reader is invited to discover and experience an extensive arsenal of modeling and simulation features from the perspective of microwave practitioners, building on their traditional design experience, their knowledge of laboratory practices and their intuitive understanding of microwave components and systems. However, the focus on practical design applications will also be invaluable to students, researchers and educators who use electromagnetic simulators for demonstration, analysis and physical insight.”
---Microwave Journal, October 2003
Preface.

Introduction - Applications of Field Solvers. History of Field-Solver Development.

CAD Development - Development of Circuit Theory Based CAD. Circuit Theory Tools Versus Field Theory Tools.

Numerical Electromagnetics - Solution Strategy. Intro to Basis Functions. Method of Moments. Finite Element Method. Finite Difference Time Domain. Transmission Line Matrix Method.

Alternative Classifications - 2D, 2.5D, 3D Solvers. Frequency Domain, Time Domain, Eigensolver.

Moment Method Simulators ‑ Strengths and Weaknesses. Validation Structures. Meshing and Convergence. Controlling Meshing. Calibration Structures. Visualization.

Finite Element Method Simulators - Strengths and Weaknesses. Validation Structures. Meshing and Convergence. Controlling Meshing. Calibration Structures. Visualization.

FDTD and TLM Simulators -- Strengths and Weaknesses. Validation Structures. Meshing and Convergence. Controlling Meshing. Calibration Structures.

Ports and De-Embedding - Connecting Fields to Circuits. De-Embedding and Unterminating. Closed Box MoM Ports. Laterally Open MoM Ports. 3D FEM Ports. 3D FDTD and TLM Ports. Internal, Lumped and Gap Ports. Symmetry and Ports.

Summary for Introduction to Methods -- Meshing Summary. Validation Structures. Calibration Structures. Ports and De-Embedding.

Microstrip - Discontinuities. Vias and Slots. Bends. Tee-Junctions. Quasi-TEM Behavior. Evanescent Modes. Loss. Compaction of Circuits.

Computing Impedance - Computing Zo and åeff. Symmetry. Coupled Line Parameters. CPW with Dielectric Overlay. Buried Transmission Lines.

Vias, Via Fences and Grounding Pads - Vias in FR4. Via Modeling. Via Fences, Grounding Metal Pads.

Multilayer Printed Circuit Boards - Multilayer Transitions. Controlled Impedance Transition. Broadband Switch Matrix.

Connectors - Low Cost SMT Connector. Edge Launch SMA Connectors. Through Hole SMA Connectors.

Backward Wave Couplers - CPW Coupler. Metal Thickness. Lange Couplers. 15dB Coupler. Right Angle Transition.

Microstrip Filters – Interdigital Filters. Edge-Coupled Filters. 22.5GHz Bandpass Filter. 3.7GHz Bandpass Filter. 1.5-5.5GHz Bandpass Filter. 22.5GHz Bandstop Filter.

Other Microwave Filters - Coaxial Lowpass. Combline. Cavity Combline.

Choosing the Right Software - The Solution Process from Start to Finish. Features All Tools Must Have. Features That Are Nice to Have. Ease of Use and Total Solution Time. Viets List of Questions.

Appendix A - Survey of Commercial Field-Solver Software.

Appendix B - List of Software Vendors.

Appendix C - List of Web Sites.

Glossary.

Daniel G. Swanson, Jr. is associated with the Advanced Development Group, Forem USA, Amesbury, MA. He received his B.Sc. in electrical engineering from the University of Illinois at Champaign/Urbana and his M.Sc. in electrical engineering from the University of Michigan at Ann Arbor.

Wolfgang J.R. Hoefer is associated with the Department of Electrical and Computer Engineering at the University of Victoria, Victoria, BC, Canada. He received his Diplom Engineering degree at the University of Aachen and his Doctor of Engineering degree from the University of Grenoble. He is cofounder and president of Faustus Scientific Corporation.